Compound products (Putty, Sealing material), Epoxy adhesive

Product Summary

Sealing Compound, Epoxy Adhesive, Hot Melt Adhesive

CONTACT

お問い合わせ

Please feel free to contact us

Inquiry by email info@hosoda-jp.co.jp

Telephone: (Week Day: 9:30 – 17:00)

TEL 06-6361-5351

keyboard_arrow_up